ic manufacturing processes meaning in English

集成电路制造工艺

With the development of ic manufacture process and the enhancement of its design complexity , the verification requirement to ic is much higher
随着集成电路制造工艺的发展和设计复杂度的增长,对集成电路的验证提出了更高的要求。
With the development of the ic manufacture processing technology , the research on the sub - deep micro theory and technology of ip core design are concerned by both research society and industry world
随着集成电路制造工艺的发展，深亚微米效应理论及ip核设计技术越来越受到理论界和工业界的广泛关注。
As the ic manufacturing process develops from sub - micron to very deep submicron ( vdsm ) technologies , with current lithography tools ( 248nm and 193nm ) , foundries can not manufacture products that designs want because of so - called optical proximity effect ( ope )
当集成电路生产工艺发展到纳米级时，利用现有的曝光设备( 248nm和193nm ) ，由于所谓的光学邻近效应，集成电路制造厂商已经无法制造出满足电路功能要求的产品。